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HP CEO Statement on CHIPS Award

Enrique Lores, Chief Executive Officer

August 27, 2024

 
HP is pleased to announce we have signed preliminary terms for a proposed $50 million award from the US Department of Commerce today from the CHIPS and Science Act in support of our microfluidics semiconductor fab in Corvallis, Oregon. This proposed investment provides HP with an opportunity to modernize and expand our facility to further advance our microfluidics technology, which is the study of the behavior and control of fluid on a microscopic scale. Microfluidics has the potential to drive revolutionary changes across industries, delivering speed, efficiency, and precision, to help pave the way for the next generation of innovation in life sciences and technology.  
  
We would like to thank the Biden-Harris Administration and Secretary Raimondo, as well as the Oregon congressional delegation, including Senators Wyden and Merkley and state leaders including Governor Kotek, Representative Rayfield, and Senate President Wagner for their support and advocacy throughout this process. In addition, we are thankful to the bipartisan leaders in Congress who championed the CHIPS Act and thereby made this proposed award possible, including Leader Schumer and Senators Young, Cornyn, and Warner. We look forward to continuing to work to accelerate our innovation in microfluidics and Micro-Electro-Mechanical Systems (MEMS) technology while expanding our manufacturing and R&D capabilities in Corvallis.

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HP Inc. (NYSE:HPQ) is a global technology leader and creator of solutions that enable people to bring their ideas to life and connect to the things that matter most. Operating in more than 170 countries, HP delivers a wide range of innovative and sustainable devices, services and subscriptions for personal computing, printing, 3D printing, hybrid work, gaming, and more. For more information, please visit: HP.com.
 
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