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If you have specific technology licensing needs that you think HP can help you with, we invite you to contact us.
Mature CPU design (Alpha-EV68, based on CMOS8 Aluminum Technology) including IP are available for licensing and some design documents (model of architecture, behavioral, and performance; design manuals; schematics and layout database) are available for reference.
HP offers TSMC foundry-specific hard macro designs for PLL, clock generation/distribution, SRAM array and PCI-Express (physical layer) IP cores. These IP Cores have been proven in silicon, characterised and well-documented.
Auger describes a novel technology to mix and dispense two-part adhesives, like epoxy, through a motorized drive mechanism in precise quantities of less than one mm3. Invention has application in the electronics and automobile robotics industry.
HP's Auto-MDIX technology describes an apparatus for configuring network media connections in local area networks. The key benefit of this technology is to eliminate the need for special "crossover" cables when connecting LAN devices together.
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HP Leadfree Testability solution consists of proven technology and know-how that enables manufacturers to substantially improve testability in the leadfree manufacturing environment.
HP has developed a unique low cost NIL technology that minimizes alignment error during imprint process and enables the making of real, operating circuits with a half-pitch width of 30 nanometres. In addition, HP has developed a low-cost and flexible nano-alignment technique based on HP's optical displacement products that requires no special alignment targets.
HP's PCI-X provides for a full-function implementation of Verilog RTL source code as a design example of a 64-bit PCI-X 266 and PCI-X 533 interface core. HP's PCI-X technology is silicon proven and widely used in the industry. Major PCI-X application developers are users of HP's PCI-X technology.
Promising applications for solder jet technology include solder bumping for electrical interconnects, deposition of metal patterns for non-electrical applications such as joining or gasketing, and fabrication of three-dimensional metal structures. The HP solder jet technology has no operating temperature limitation and can eject high-lead solders, which are important for bumping.
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