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HP 9000 rp7420 Server
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HP 9000 rp7420 Server

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Specifications

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Technical specifications
Performance/Scalability/Flexibility
  • Up to 8 processors / 16 processor cores
    • PA-8900 (1.0 GHz or 1.1 GHz with 1.5 MB L1 cache/64 MB combined L2 cache)
  • 1 to 2 cell boards (each cell: 2–8 processors and 2 to 64 GB memory)
  • 2 to 128 GB memory capacity
  • 15 PCI-X internal hot-plug I/O card slots
  • 4 internal disk bays and 1 internal removable media bay (DVD + RW or DAT)
  • Up to 2 hardware partitions (nPars)
  • Support for up to 16 virtual partitions (vPars)
  • 16 GB/s aggregate I/O slot bandwidth
  • Rack and standalone server solutions
  • Hot-swap, redundant power supplies
  • Redundant (2N+1) input power
  • Hot-swap, redundant cooling fans
Operating system HP-UX 11i v3, HP-UX 11i v2 and HP-UX 11i v1 (choice of Foundation, Enterprise, Mission-Critical, and Technical Computing operating environments)
Availability
  • Dynamic CPU and memory allocation/de-allocation
  • Memory chip-sparing technology
  • Hot-plug cell boards
  • Hot-plug fans
  • Error checking and correction (ECC) on all CPU, cache, memory, and I/O paths
  • Online addition and replacement of PCI-X I/O cards
  • Redundant power inputs for dual grid connections
  • N+1 hot-swappable fans and power supplies
  • Hot-spare Instant Capacity-delete on demand - CPU functionality
  • Hardware partitions (nPars)
Connectivity
  • Core I/O: 10/100/1000Base-T LAN, Ultra3 SCSI, management LAN, 3 serial ports
  • Add-in cards: ATM, Token Ring, FDDI, 1000Base-SX, 1000Base-T, 10/100Base-T, Ultra2, Ultra3, Fibre Channel, terminal MUX, Hyperfabric,combo cards
Investment protection and flexibility
  • Utility pricing–Pay per use, Instant Capacity, and Pay per forecast
  • Temporary Instant Capacity
  • Cell Instant Capacity
  • Chassis designed for future generations of
    Intel® Itanium® processors
  • Ability to mix PA-8800 and PA-8900 processors and speeds within a partitioned system
  • Interchangeable components with other HP servers and storage solutions
  • HP-UX 11i OS binary, source, and data compatibility and Linux® and Windows® interoperability
Manageability HP Management solutions deliver the software and services needed to manage todays most demanding IT environments. These solutions help your organization reduce operational costs, increase staff efficiencies, improve application availability and optimize service delivery.

» Learn more

Optional high-availability and business-continuity solutions HP High Availability & Business Continuity solutions help reduce operational risk, enhance IT performance and develop stable, reliable and agile enterprises.
  • Business Continuity
  • High Availability Management
  • Disaster Tolerance
  • Data Protection and Recovery
  • Security
» Learn more
Rack-optimized design
  • Rackmount solution offering allows server to fit into 10U (44.45 cm height) space in all HP racks (Rack System/E and 10000 series rack)
  • J1530B: HP field rack kit
  • J1530BZ: HP factory rack kit
For a complete list of racks and rack accessories, refer to http://h18004.www1.hp.com/products/servers/proliantstorage/bcs-rackandpower/index.html
Physical and environmental specifications
Physical dimensions
Height Racked chassis: 17.5 in. (445 mm); 10U EIA
Standalone chassis: 20.75 in. (527 mm)
Width 19 in. (483 mm)
Depth 30 in. (762 mm)
Net weight
Maximum configuration 220 lb. (99.8 kg)
Temperature
Operating +41° to +95° F (+5° to +35° C); 86° F (30° C) @ 10,000 ft. (3000 m)
For altitudes > 5,000 ft., derate max. temp. by 1.8 F° (1° C) per 1000 ft. (300 m)
Non-operating –40° to +158° F (–40° to +70° C)
Maximum rate of temperature change 36° F (20° C) per hr
Humidity
Operating 15% to 80% RH non-condensing: max. wet bulb = 78° F (26°C)
Altitude
Maximum operating 10,000 ft. (3000 m)
Maximum non-operating 15,000 ft. (4500 m)
Power requirements
Input current 200–240 V
AC input power 50–60 Hz
Typical power dissipation 2015 VA (max. configuration)
10.1 A @ 200 Vac
Regulatory
Safety UL listed, CUL certified, TÜV GS Mark, compliant with EN 60950
Electromagnetic interference Complies with FCC rules and regulations, Part 15 as a Class A Digital Device; Manufacturer's Declaration to EN55022 Level A, VCCI
Power line LF emissions Registered, Class I, Korea RLL
Europe: EN 61000-3-2; Europe: EN 61000-3-3

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