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The HP BladeSystem carrier-grade platform is comprised of several components:
- HP BladeSystem c7000 carrier-grade enclosure consolidates up to 16 half-height server blades with network, power, and management capabilities. It provides DC power, cooling, and I/O infrastructure.
- HP ProLiant BL460c carrier-grade server blade, with two dual-core Intel® Xeon™ series processor performance, greater memory capacity, hot-plug SAS drives, simultaneous support of multiple I/O cards, and enhanced remote management capabilities.
- HP Virtual Connect architecture simplifies networks, simplifies server connections, and enables you to change servers with radical ease, along with the unique ability to wire everything once and then add, replace, or recover servers in minutes vs. hours or days.
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Finding a solution that meets the specific needs of any industry necessitates—first and foremost—an adaptable infrastructure that can accommodate different and continually evolving requirements. Of course, acquisition and operating costs factor heavily into this equation. That’s why many companies are looking to the HP BladeSystem as the building block of tomorrow’s network data center. Based on a modular design, HP blade technology is providing the foundation for the future while reducing the amount of time and money that telecommunication companies spend on IT.
Current HP BladeSystem architectures are renowned for being cost-savvy, change-ready, energy-thrifty, and time-smart. With the introduction of the HP BladeSystem c7000 carrier-grade enclosure and HP ProLiant BL460c carrier-grade server blade, the same benefits are now available for network equipment providers (NEPs) and communication service providers. Designed for the specific requirements of this industry, HP BladeSystem now offers DC power, long lifecycles, Networking Equipment Building Systems (NEBS) certification, high reliability, enhanced support for OpenHPI, and carrier-grade Linux at a fraction of the cost of traditional systems.
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