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HP BladeSystem Carrier-Grade Enclosure

Engineered for the most demanding telecommunication applications

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BladeSystem Carrier-Grade Enclosure

 

  • NEBS Level-3 and ETSI certified
  • Consolidates up to 16 half-height server blades with network, power, and management capabilities.
  • Provides DC power, cooling, and I/O infrastructure.
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» Overview

Specifications

» Key Benefits

 
Enclosure—HP BladeSystem c7000 carrier-grade enclosure
Dimensions

Height: 10U, 17.4 in. (442 mm)
Width: 17.5 in. (445 mm)
Depth: 36.7 in. (933 mm)

Enclosure weight Unboxed: 450 lb.
Shipping: 493 lb.
Rack size 40 in. (1000 mm)
Backplane interface (512) 10GbE
2–8 GE
Fibre Channel
2 custom mezzanine per blade
CPU payload slots 16 half-height
DC input module Replaces AC input module Connects power supplies to input feeds
DC power supply High-efficiency, -48 V input, 12 V/2250 W output power supply accommodates full –36 V to –72 V input range.
  • Rated input current per power supply: 75 A
  • Rated input power per power supply: 2700 W
  • Max input current per line cord: 75 A
  • Max input power per line cord: 2700 W
  • Operating temperature range: –5° to 55° C Input hold up: 0.5 ms
  • RoHS compliance: 6 of 6
Replaces AC-input power supply and has same rated output voltage and power

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