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The HP BladeSystem c7000 carrier-grade enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server and interconnect components today and throughout the next several years. The enclosure is10U high and holds up to 16 server blades, plus optional redundant network interconnect modules. It includes a shared, 5 terabit per second high-speed midplane for wire-once connectivity of server blades to network and shared storage. Power is delivered through a pooled-power backplane that ensures the full capacity of the power supplies is available to all server blades for maximum flexibility and redundancy. Power input is provided with -48V DC Input.
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