HP Dynamic Smart Cooling

Nov. 29, 2006 - Building on its history of innovations within the data center, HP is bridging the gap between IT and facilities management by enabling businesses to reduce power and cooling inefficiencies in their data centers by 20 to 45 percent.

The company's power and cooling initiative brings together HP technology, solutions, people and partners to tackle the issue of energy-aware provisioning and thus enable businesses to manage power as a resource for both cost efficiencies and data center scalability. The initiative includes:

• HP Dynamic Smart Cooling -- The first solution of its type, Dynamic Smart Cooling delivers significant cost-savings with space and energy-efficient solutions for the data center. Leveraging HP Thermal Logic technology, Dynamic Smart Cooling enables the next-generation data center by addressing power and cooling issues effectively and efficiently.
• Power and Cooling Solution Builder Program -- A collaboration with leading technology and service providers, the program simplifies customer adoption of HP power and cooling technology and drives toward industry standards. The program allows HP to deliver broader features and capabilities for data centers with the support customers demand for their channel of choice.
• Smart Data Center Design Team -- A dedicated team from HP's hardware, software and services business units that researches, designs and develops cutting-edge power and cooling solutions to help businesses gain more control over the performance of data center investments.
• HP 3 Phase Power Portfolio -- A new power protection and distribution infrastructure, 3 Phase Power provides higher levels of power density to rows of servers and storage across the data center, allowing IT infrastructures to support various rack level power requirements, monitor power usage and cost-effectively distribute power.

	HP Bridges Gap Between Facilities and IT to Solve Data Center Power and Cooling Challenges