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HP Newsroom > News releasesNews release |
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HP Collaborates with Hynix to Bring the Memristor to Market in Next-generation Memory Technology from HP Labs will enable quicker, more energy-efficient computing PALO ALTO, Calif., Aug. 31, 2010
HP today announced that it has entered into a joint development agreement with Hynix Semiconductor Inc., a world-leading memory supplier, to bring memristor, a new circuit element first intentionally demonstrated in HP Labs, to market in future memory products. Highlights
Memristor research from HP Labs Memristors require less energy to operate, are faster than present solid-state storage technologies and can retain information even when power is off. The memristor, short for “memory resistor,” was postulated to be the fourth basic circuit element by Prof. Leon Chua of the University of California at Berkeley in 1971 and first intentionally reduced to practice by researchers in HP Labs, the company’s central research arm, in 2006. Earlier this year, HP announced the discovery that the memristor also can perform logic, showing that memristor-based devices could change the standard paradigm of computing by enabling computation to one day be performed in chips where data is stored, rather than on a specialized central processing unit. Bringing research to market Joint development agreements are one way in which HP partners with others to leverage its intellectual property, which includes a portfolio of more than 30,000 patents. By collaborating with others to bring new technologies to market through intellectual property licenses and other technology transfer agreements, HP helps create new markets and generates a return on its research and development investment. Supporting quotes “The memristor has storage capacity abilities many times greater than what competing technologies offer. By adopting HP’s memristor technology we can deliver new, energy-efficient products to our customers more quickly.”
“This agreement brings together HP’s core intellectual property and a first-rate supplier with the capacity to bring this innovation to market in world-class memory on a mass scale. It is the most recent example of HP’s ability to drive product innovation from the Labs out into the commercial world. This is discovery and invention with clear purpose, which differentiates HP and reinforces the value of our research enterprise to HP as a whole.”
Additional resources
About Hynix Semiconductor Inc. Hynix Semiconductor Inc. (HSI) of Icheon, Korea, is the world’s top tier memory semiconductor supplier offering Dynamic Random Access Memory chips (DRAMs), Flash memory chips (NAND Flash) and CMOS Image Sensor (CIS) for a wide range of distinguished customers globally. The company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about Hynix is available at www.hynix.com. About HP HP creates new possibilities for technology to have a meaningful impact on people, businesses, governments and society. The world’s largest technology company, HP brings together a portfolio that spans printing, personal computing, software, services and IT infrastructure to solve customer problems. More information about HP (NYSE: HPQ) is available at http://www.hp.com/. This news release contains forward-looking statements that involve risks, uncertainties and assumptions. If such risks or uncertainties materialize or such assumptions prove incorrect, the results of HP and its consolidated subsidiaries could differ materially from those expressed or implied by such forward-looking statements and assumptions. All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including but not limited to statements of the plans, strategies and objectives of management for future operations; any statements concerning expected development, performance or market share relating to products and services; any statements regarding anticipated operational and financial results; any statements of expectation or belief; and any statements of assumptions underlying any of the foregoing. Risks, uncertainties and assumptions include macroeconomic and geopolitical trends and events; the execution and performance of contracts by HP and its customers, suppliers and partners; the achievement of expected operational and financial results; and other risks that are described in HP’s Quarterly Report on Form 10-Q for the fiscal quarter ended April 30, 2010 and HP’s other filings with the Securities and Exchange Commission, including but not limited to HP’s Annual Report on Form 10-K for the fiscal year ended October 31, 2009. HP assumes no obligation and does not intend to update these forward-looking statements. © 2010 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
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