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Greenhouse gas emissions

We are committed to becoming more energy efficient across our business to reduce our total operational carbon footprint. In 2009, following integration of EDS , we set a new goal to reduce our absolute energy consumption and the resulting greenhouse gas (GHG) emissions from HP-owned and HP-leased facilities worldwide to 20 percent below 2005 levels, by the end of 2013.

We calculate our GHG emissions according to the GHG Protocol of the World Business Council for Sustainable Development and the World Resources Institute.1 GHG emissions from HP employee business travel are reported here. We estimate emissions from product manufacturing, product transport, and product recycling (which has a net benefit).2 Although these are not under our direct control, we have programs to reduce them.

Performance

We reduced global GHG emissions from operations (not including employee business travel) by 214,500 tonnes of CO2e in 2009 compared with 2008, a 10 percent decrease. This was due to several main factors related to energy use:

  • A decrease of 9 percent in square footage, largely due to the integration of EDS after the acquisition in 2008
  • Success in numerous energy-reduction initiatives (See Energy use.)
  • An increase in renewable energy purchases from 2.5% to 3.6% of total electricity purchases
  • Purchases of other large hydroelectric energy contracts in several countries in Europe
Greenhouse gas emissions, 2005–2009 [tonnes CO2e]*
Stacked column chart
      2005 2006 2007 2008 ** 2009
  yellow Americas 1,327,400   1,154,000
  orange Europe, Middle East and Africa 338,800   336,900
  red Asia Pacific and Japan 499,300   460,100
  medium blue Total 2,273,800 2,165,500   1,951,000
* Data for 2005 reflect the reset baseline including EDS and other acquisitions since 2005. Data for 2008 and 2009 include EDS and all other acquisitions. Revised calculations for 2006 and 2007 were not performed.
** EDS data for 2008 have been modified compared with data previously reported to exclude customer-owned and operated facilities.

The sources of GHG emissions from HP operations in 2009 were as follows:

Electricity 93%
Natural gas 4%
Refrigerant emissions 2%
Diesel 1%
Manufacturing emissions <1%

See the regional breakdown of GHG emissions per square meter in the data dashboard.

Perfluorocarbons

Perfluorocarbons (PFCs) are gases used widely in the semiconductor industry for cleaning and etching. The global warming potential of PFCs ranges from 6,500 to 23,900 times greater than that of CO2.

HP’s PFC emissions from operations3 accounted for less than 1 percent of our total GHG emissions in 2009. In the United States, we participate in the EPA-SIA PFC Emission Reduction Partnership to reduce specified PFC emissions by 10 percent from 1995 levels by the end of 2010.

We achieved our target worldwide in 2006 through process improvements and emissions abatement, and have continued to reduce PFC emissions to less than 3,700 tonnes CO2e in 2009. This represents an 88 percent reduction (over 23,000 tonnes) from the 1995 baseline, including a reduction of 74 percent (over 8,500 tonnes) between 2008 and 2009. The recent reduction is due primarily to scaling back semiconductor fabrication operations.

See the breakdown by type of PFC in the data dashboard.

  1. 1 The World Resources Institute (WRI) defines Scope 1, 2 and 3 greenhouse gas emissions in its Greenhouse Gas Protocol link to PDF non-HP site.
  2. 2 According to the U.S. Environmental Protection Agency's Waste Reduction Model (WARM) Tool, CO2e reductions from recycling are calculated per the following formula: 1.858 kg CO2e / kg recovered electronic waste.
  3. 3 PFC emissions do not include HP supply chain.